General Specification for Hybrid Integrated Circuit Enclosures 1 Scope This specification specifies the general requirements for the production and delivery of military hybrid integrated circuit enclosures, as well as the quality and reliability assurance requirements that should be met. This specification applies to metal enclosures for military hybrid integrated circuits, solid-state relays, surface acoustic waves, and fiber optic devices, as well as ceramic enclosures for such devices. 2. The relevant clauses in the following documents become the clauses of this specification through reference. Any reference document with a date or revision shall not be applicable to this specification in any subsequent modification list (excluding corrected content) or revised version. However, parties advocating the use of this specification shall explore the possibility of using its latest version. For referenced documents without date or revision, the latest version applies to this specification. GBn 97-1987 Technical Conditions for Iron Nickel Cobalt Glass Sealing Alloys 4J29 and 4J44 GBn 103-1987 Technical Conditions for Iron Nickel Chromium and Iron Nickel Sealing Alloys GB/T 14113-1995 Semiconductor Integrated Circuit Packaging Terminology GJB 179 Counting Sampling Inspection Procedures and Tables GJB 360A-1996 Test Methods for Electronic and Electrical Components GJB 548 Test Methods and Procedures for Microelectronic Devices SJ 20129 Measurement Methods for Metal Coating Thickness SJ 20151 Specification for Nickel Strip for Electronic Devices SJ20152 Nickel Rod for Electronic Components Nickel wire specification IEC 60191-2 Mechanical standardization of semiconductor devices Part 2: Dimensional 3 Requirements 3.1 General: The shell shall comply with all the requirements of this specification and the corresponding detailed specifications. In case of any inconsistency between the requirements of this specification and the relevant detailed specifications, the relevant detailed specifications shall prevail
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