Test items: TEM sample preparation, projection electron microscopy sample preparation (TEM) - FIB dual focus ion beam detection range: integrated circuit, chip detection standard: GJB 4027A-2006 Transmission Electron Microscope (TEM), can see fine structures less than 0.2um that cannot be clearly seen under an optical microscope, these structures are called sub microstructure or ultra microstructure. Basic principle: After the interaction between electrons and the sample, the transmitted electrons are mainly divided into three categories: transmitted electrons, elastic scattering electrons, and inelastic scattering electrons. These three types of electrons each perform their respective duties, with both transmitted and elastic scattered electrons being used for imaging. By adjusting the electron microscope parameters, imaging electrons can be selectively collected. If only transmission electron imaging is chosen, it can be imagined that the areas without samples have the most electron transmission, so the observation screen is the brightest. The heavier and thicker the sample, the darker the areas where electrons are difficult to penetrate. This is the so-called "Ming Chang Xiang". The difference in brightness caused by uneven thickness and quality of the sample is referred to as "quality thickness contrast". Since there is a "bright field image", there must be a "dark field image". The so-called "dark field image" refers to the "collection" of scattered (diffracted) electron imaging. Because the larger and thicker the mass, the stronger its scattering, so it becomes brighter in the dark field. Using FIB to prepare TEM samples of various types, including blocks, films, chips, particles, etc. The scope of damage is small, and it can be used for sample preparation of powders, micro nanowires, and cultural relics. FIB focused ion beams are like a surgical knife with a tip of only tens of nanometers. The secondary electron imaging generated by ion beams on the surface of the target material has nanoscale microscopic resolution, so the focused ion beam system is equivalent to a microfabrication platform that can be operated under a high-power microscope. It can be used to sputter and peel or deposit materials at any location. Detection content: Use FIB ion beam to cut the designated failure location of integrated circuits (chips), and observe the cause of failure and doping impurities at a microscopic level. In the fields of microelectronics, semiconductors, and various functional devices, there are many and complex processes involved. In the development and testing of a device, there are always deviations between the actual results and design indicators, device failures after testing, logical functional abnormalities, and so on. The intuitive and reliable analysis of the above problems is to prepare corresponding device profiles, and intuitively characterize the reasons for device anomalies from a physical level. In the fields of microelectronics, semiconductors, and various functional devices, there are many and complex processes involved. In the development and testing of a device, there are always deviations between the actual results and design indicators, device failures after testing, logical functional abnormalities, and so on. The intuitive and reliable analysis of the above problems is to prepare corresponding device profiles, and intuitively characterize the reasons for device anomalies from a physical level. Both transmission electron microscopy and scanning transmission electron microscopy samples require the preparation of very thin samples, so that electrons can penetrate the sample and form electron diffraction images. The traditional method for preparing TEM samples is mechanical slicing and grinding, which can only analyze large area samples. Focused ion beams can be used to observe a local section of the sample. Similar to the method of cutting cross-section, TEM samples are made by processing them from both the front and back directions using a focused ion beam, leaving a thin area in the middle as the sample for TEM observation. The above article is a partial list. For more testing needs and details, please consult the online consultant of the free consulting agency: 15201733840 (phone and WeChat). We conduct testing on the top 100 inspection websites - issuing authoritative testing reports has legal effect