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CT semiconductor packaging inspection

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CT semiconductor packaging inspection

With the rapid development of electronic technology, high-density assembly, miniaturization of packaging, and the continuous emergence of various new packaging technologies, the requirements for electronic assembly quality are also increasing. Traditional detection methods cannot detect the internal defects of packaging devices. X-ray three-dimensional industrial CT can clearly observe the distribution of electronic components and the internal structure of packaging devices without damaging the sample, and can achieve comparison with design documents. At the same time, it can detect defect information such as solder joints, tin connections, and broken wires. It can play an important guiding role in improving and enhancing the later processing technology< p>

3D CT inspection image of the area of interest of the circuit board

Detection results of capacitor solder joint defects

Detection results of solder ball defects

There is solder joint defect in the red box

The solder joint defect may cause poor capacitor contact, or even detachment, which will greatly affect system stability

There are many pores (blue) inside the solder ball.

, Poor welding quality

The above article is a partial list. For more testing needs and details, please consult the online consultant of the free consulting agency: 152 0173 3840 (phone and WeChat), conducting testing on over a hundred inspection websites - issuing authoritative testing reports has legal effect

Function of testing report:

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Baijian and testing process:

1. Telephone communication and confirmation of requirements

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Testing and testing characteristics:

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7. Possess authoritative qualifications such as CMA, CNAS, CAL, etc

8. The testing report is authoritative and effective, and is generally used in China